ACME 25MM XPS INSULATED OVERLAY BOARD

25MM XPS300 OVERLAY BOARD FOR 16MM UNDERFLOOR HEATING PIPE

THIS 25MM XPS300 OVERLAY BOARD PROVIDES A LOW-PROFILE SOLUTION FOR WATER UNDERFLOOR HEATING INSTALLATIONS. MANUFACTURED FROM HIGH-DENSITY EXTRUDED POLYSTYRENE (XPS), IT OFFERS EXCELLENT THERMAL INSULATION, HIGH COMPRESSIVE STRENGTH AND A LIGHTWEIGHT DESIGN. THE BOARD IS SUPPLIED WITHOUT AN ALUMINIUM FOIL LAYER, MAKING IT IDEAL FOR APPLICATIONS WHERE A DIRECT SCREED, SELF-LEVELLING COMPOUND OR TILE ADHESIVE FINISH IS REQUIRED.

SPECIFICATION

• BOARD DIMENSIONS: 1200 × 600 × 25MM
• COVERAGE: 0.72M² PER BOARD
• MATERIAL: HIGH-DENSITY XPS (EXTRUDED POLYSTYRENE)
• COMPRESSIVE STRENGTH: 300KPA
• THERMAL CONDUCTIVITY (λ): 0.034–0.035W/MK
• SURFACE: PLAIN XPS (NO ALUMINIUM FOIL)
• PIPE SIZE: SUITABLE FOR 16MM UNDERFLOOR HEATING PIPE
• PIPE SPACING: 150MM CENTRES
• PRE-ROUTED PIPE CHANNELS WITH SMOOTH RETURN BENDS

FEATURES

• LOW-PROFILE SYSTEM FOR MINIMAL FLOOR BUILD-UP
• HIGH THERMAL INSULATION TO REDUCE DOWNWARD HEAT LOSS
• HIGH COMPRESSIVE STRENGTH FOR RESIDENTIAL AND LIGHT COMMERCIAL APPLICATIONS
• CLOSED-CELL, WATER-RESISTANT XPS CONSTRUCTION
• LIGHTWEIGHT, EASY TO HANDLE AND SIMPLE TO CUT
• PRE-ROUTED CHANNELS FOR FAST PIPE INSTALLATION
• NO PIPE CLIPS REQUIRED IN MOST INSTALLATIONS
• SUITABLE FOR DRY AND SCREED-OVER UNDERFLOOR HEATING SYSTEMS

APPLICATIONS

SUITABLE FOR:

• NEW-BUILD AND RETROFIT UNDERFLOOR HEATING INSTALLATIONS
• CONCRETE AND SCREED SUBFLOORS
• APPLICATIONS WHERE FLOOR BUILD-UP HEIGHT IS LIMITED
• AREAS WHERE AN ALUMINIUM HEAT-SPREADER LAYER IS NOT REQUIRED

INSTALLATION

INSTALL THE BOARDS OVER A CLEAN, LEVEL AND STRUCTURALLY SOUND SUBFLOOR USING A SUITABLE ADHESIVE. LAY THE PANELS IN A STAGGERED BRICK-BOND PATTERN, INSERT 16MM PEX OR PE-RT PIPE INTO THE PRE-ROUTED CHANNELS, PRIME THE SURFACE, APPLY A SUITABLE SELF-LEVELLING COMPOUND, AND COMPLETE THE INSTALLATION WITH THE SPECIFIED FLOOR FINISH.